据《实装技术》2002年Vol18,No.3上报道,田中电子工业公司开发出了直径为10μm的金键合引线(极细金线)的批量生产技术。目前,在半导体领域中,正在使用直径为25～30μm的金键合引线,但是随着移动电话和信息终端设备的小型化和薄型化,半导体封装的集成化也在飞速进展,这就要求要有比现在的键合引线更细的引线。 According to “Fitting Technology”, Vol .18, No.3, 2002, Tanaka Electronics Co., Ltd. has developed a mass production technology of gold bond wire (very thin gold wire) with a diameter of 10 μm. At present, in the field of semiconductors, gold bonding wires 25 to 30 μm in diameter are being used. However, with the miniaturization and thickness reduction of mobile phones and information terminal devices, the integration of semiconductor packages is also rapidly progressing, Now the bonding wire finer leads.