一引言半导体封装是半导体器件和集成电路的重要组成部分,它的主要功用有两条:一是为芯片工作提供一个适宜的环境;二是实现芯片和电路的连接。因此,管壳的主要结构总是由密封腔体和连接件两部分组成。腔体把芯片同外部环境隔离开来,防止各种有害气体和杂质的污染,并将芯片有源区产生的热量传导给外部热沉,使器件在一定的结温下工作。管壳的内外引线及接插件可以适当的匹配方式把芯片和外电路连接起来。半导体封装技术的发展,各种新结构、新材料、新工艺的出现,主要也是围绕着以上两个问题。比如,为了解决气密性问 I. INTRODUCTION Semiconductor packaging is an important part of semiconductor devices and integrated circuits. Its main functions are twofold: one is to provide an appropriate environment for the operation of the chip; the other is to realize the connection between the chip and the circuit. Therefore, the main structure of the envelope is always composed of two parts sealed chamber and connector. The cavity isolates the chip from the external environment to prevent the pollution of various harmful gases and impurities, and conducts the heat generated in the active area of ​​the chip to the external heat sink so that the device works under a certain junction temperature. The inner and outer leads of the package shell and the connectors can connect the chip and the external circuit in a proper matching manner. The development of semiconductor packaging technology, the emergence of a variety of new structures, new materials, new processes, mainly around the above two issues. For example, in order to solve the problem of air tightness