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达迈科技的研发团队开发出一款新型超薄PI膜(厚度1~5μm)Skin Tran,可应用于超薄型覆盖膜及软性铜箔基层板,在维持原有制程并控制良好的成本效益下,完成轻量化、低反弹力软板之制造。另外,延续2016 TPCA展出的毫米结构识别PI膜(tPI),达迈科技在2017年藉由独特的PI制模技术,开发出具有微米结构的PI机能膜材。在显示与照明领域中,可提供做为光学扩散及增亮的用途。
DAMA Technologies R & D team has developed a new ultra-thin PI film (thickness 1 ~ 5μm) Skin Tran can be applied to the ultra-thin cover film and soft copper substrate, while maintaining the original process and control the good cost Benefit, to complete the lightweight, low rebound soft board manufacturing. In addition, following the continuation of the millimeter-structure-identified PI membrane (tPI) presented at TPCA 2016, DAMA Technologies developed a PI-capable membrane with micron structure in 2017 through a unique PI molding technology. In the field of display and lighting, it can be provided for optical diffusion and brightness enhancement.