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综述了集成电路互连引线的发展历史以及研究进展,从最初的铝互连引线到现在主流的铜互连引线,再到下一代碳纳米管互连引线。首先,介绍了铝作为互连引线材料的优点与其所存在的缺陷及改进方法,例如电迁移现象等问题的形成原因以及相应的克服方法。然后,探究了铜在互连方面的相关性质,分析了铜取代铝作为互连线材料的原因,并重点研究了制备铜互连线的双镶嵌工艺流程以及相关技术。最后,指出了铜互连线发展中存在的问题,讨论了碳纳米管作为下一代互连引线材料所具有的优势及其所面临的挑战,介绍了碳纳米管电子器件装配以及焊接的相关技术。
The development history and research progress of integrated circuit interconnection leads are reviewed. From the initial aluminum interconnection leads to the current mainstream copper interconnection leads and the next generation of carbon nanotube interconnection leads. First of all, the advantages and disadvantages of aluminum as interconnection lead material and its improvement methods are introduced, such as the reasons for the formation of electromigration phenomenon and the corresponding overcoming methods. Then, the related properties of copper in interconnection were explored. The reason why copper was replaced by aluminum as the interconnection material was analyzed. The dual damascene process and related technologies for preparing copper interconnect lines were also studied. Finally, the problems existing in the development of copper interconnection lines are pointed out. The advantages and challenges of carbon nanotubes as the next generation of interconnection lead materials are discussed. The related technologies of assembly and welding of carbon nanotubes .