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近日,从蓝星新材料无锡树脂厂传出消息,该厂正在积极开发无铅化环氧树脂制品,以替代传统含铅产品。目前小试已取得很大进展,实现了阶段性研发目标。印刷电路板焊锡无铅化对环氧树脂的耐热性提出了更高的标准,通用型的环氧树脂已难以达到这一要求。为此,该厂精细化工研究所从今年年初开始研发适应这种要求的双酚A酚醛树脂、双酚A酚醛环氧树脂。
Recently, news came from Bluestar New Material Wuxi Resin Factory that it is actively developing lead-free epoxy resin products to replace traditional lead products. At present small test has made great progress, to achieve a phased research and development goals. Lead-free solder on the printed circuit board on the heat resistance of epoxy resin set a higher standard, general-purpose epoxy resin has been difficult to meet this requirement. To this end, the plant fine chemical research institute from the beginning of this year to develop to meet the requirements of bisphenol A phenolic resin, bisphenol A novolac epoxy resin.