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一、概述随着电子元器件的小型化,印制电路板组件已经向高密度装配的方向发展。从而电路板组件上的焊点数目亦急剧增加,焊点数目越多,则其出现故障的机率越大。近年来,从大量电子产品在调测和使用过程中发现焊接不良造成的故障率超过40％,据日本松下电器公司的统计,电视机故障原因中的80％属于焊接质量问题。因而解决焊接不良问题是当代电子工业最重要的技术关键课题之由于虚焊点造成的故障不是一开始就表现出来,而往往经过一段时间(约几个月)后,待焊锡与导体连接部位因腐蚀和氧化而引起接触不良后才暴露出来。虚焊点造成的故障通常表现为:(a)使仪器间断工作,
I. Overview With the miniaturization of electronic components, printed circuit board assembly has been to high-density assembly direction. As a result, the number of solder joints on the circuit board assembly also increases sharply. The greater the number of solder joints, the greater the chance of failure. In recent years, a large number of electronic products in the process of commissioning and testing found that failure caused by welding failure rate of more than 40%, according to Japan’s Matsushita Electric Company statistics, 80% of the cause of the failure of the TV is a welding quality problems. So to solve the problem of poor welding is the most important technology in the electronics industry, the key issues of the fault caused by the Weld is not shown at the outset, and often after a period of time (about a few months), until the solder and conductor connections due to Corrosion and oxidation caused by poor exposure before exposure. Faults caused by the joint are usually as follows: (a) intermittent work on the instrument,