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采用常规PECVD工艺,以高H2 稀释的SiH4 作为反应气体源,以PH3 作为P原子的掺杂剂,在P型(100) 单晶硅(c- Si) 衬底上,成功地生长了掺P的纳米硅膜(nc- Si(P):H) 膜。通过对膜层结构的Raman 谱分析和高分辨率电子显微镜(HREM) 观测指出:与本征nc- Si:H 膜相比,nc- Si(P):H 膜中的Si 微晶粒尺寸更小(~3 nm) ,其排布更有秩序,呈现出类自组织生长的一些特点。膜层电学特性的研究证实,nc- Si(P):H 膜具有比本征nc- Si:H 膜约高两个数量级的电导率,其σ值可高达10- 1 ~101 Ω-1cm -1 。这种高电导率来源于nc- Si(P): H 膜中有效电子浓度ne 的增加、Si 微晶粒尺寸d 的减小和电导激活能ΔE的降低。
The P-type (100) single-crystal silicon (c-Si) substrate was successfully grown by conventional PECVD process using SiH4 diluted with high H2 as the reactive gas source and PH3 as the dopant of P atom. Nanocrystalline silicon film (nc-Si (P): H) film. By Raman analysis of the film structure and high-resolution electron microscopy (HREM) observation, it is pointed out that the size of the Si crystallite in the nc-Si (P): H film is more than that of the intrinsic nc- Small (~ 3 nm), its arrangement is more orderly, showing some of the characteristics of self-organized growth. The investigation of the electrical properties of the films confirms that the nc-Si (P): H films have an electrical conductivity about two orders of magnitude higher than the intrinsic nc-Si: H films and can have σ values of up to 10 -1 to 101 Ω-1 cm- 1. This high conductivity is derived from the increase of the effective electron concentration ne in the nc-Si (P): H film, the decrease of the Si crystallite size d and the decrease of the conductance activation energy ΔE.