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电化学刻蚀使用腐蚀性小的电解质溶液,且溶液可使用周期长,是一种环境友好的加工工艺.本文采用聚丙烯酰胺水凝胶(PAG)作为软印章,辅以优化工艺,将电化学湿印章技术(E-WETS)的加工精度从几十微米提高到了200纳米.将新配制的聚丙烯酰胺水凝胶浇注在具有纳米结构的软模板表面,固化后脱模并保存于0.2mol·L-1KCl溶液中,在合适电位和压力下,对硅片表面金膜进行电化学湿法刻蚀,分别研究了聚丙烯酰胺水凝胶的聚合条件、电化学加工电位以及水凝胶表面压力对加工结果的影响.实验表明,在最优条件下可加工出直径为200纳米的特征点阵结构,且该方法具有较好的可靠性和稳定性。
Electrochemical etching using a less corrosive electrolyte solution, and the solution can be used for a long period, is an environmentally friendly processing technology.In this paper, polyacrylamide hydrogel (PAG) as a soft seal, combined with the optimization process, the electricity The chemical wet seal technology (E-WETS) processing accuracy increased from tens of microns to 200 nanometers.The newly prepared polyacrylamide hydrogel was cast on the surface of a soft template with a nanostructure, after curing demolding and stored in 0.2mol · L-1KCl solution, under the appropriate potential and pressure, the surface of the gold film was electrochemically wet-etched, the polyacrylamide hydrogel polymerization conditions, electrochemical processing potential and hydrogel surface Pressure on the processing results.The experimental results show that under the optimal conditions, a characteristic lattice structure with a diameter of 200 nm can be fabricated, and the method has good reliability and stability.