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(一) 前言 几十年来电真空器件一直采用钼锰金属化或涂钛粉的陶瓷金属封接工艺。该工艺比较复杂,同时封接质量又不易保证。我们研究了用钛银铜(Ti-Ag-Cu)活性合金焊料直接封接的工艺;试验了合金焊料中活性元素钛含量和封接温度等参量对封接质量的影响;给出了合金焊料的合适合钛量和封接的工艺规范。实验表明,钛银铜合金焊料直接封接工艺,方法简单,质量稳定,是值得推广应用的。
(A) Introduction Decades call vacuum device has been using molybdenum manganese metal or titanium coated ceramic metal sealing process. The process is more complicated, while the quality of the seal is not easy to guarantee. We studied the process of direct sealing with titanium-copper-copper (Ti-Ag-Cu) active alloy solder. The influences of the content of active element such as titanium and sealing temperature on the quality of the sealing were tested. Suitable titanium content and sealing process specifications. Experiments show that the titanium silver copper alloy solder sealing process, the method is simple, stable quality, is worth promoting the application.