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发展状况 我国半导体致冷技术始于50年代末、60年代初。当时中国科学院半导体研究所率先研究了半导体致冷技术,在国际上也是比较早的研究单位之一。60年代中期,半导体材料的性能达到了国际水平。 改革开放,对外交流,迎来了半导体致冷技术新的发展时期,半导体致冷器的制造技术有了长足的发展。致冷材料采用大直径生长技术,致冷器采用了金属化陶瓷与光刻、印刷电路板相结合的技术,不但提高了致冷器的可靠性,而且也提高了产量,并做到了小型化、微型化。小型致冷器件,元件密度为15对/平方厘米。微型致冷器件,元件密度达到50对/平方厘米,致冷元件截
Development status China’s semiconductor refrigeration technology began in the late 50’s and early 60’s. At that time, the Institute of Semiconductors of the Chinese Academy of Sciences was the first to study semiconductor cooling technology and was one of the earlier research units in the world. In the mid-60s, the performance of semiconductor materials reached the international level. The reform and opening up and foreign exchanges have ushered in a new period of development of semiconductor refrigeration technology. The manufacturing technology of semiconductor refrigerators has made considerable progress. The cooling material adopts the large-diameter growth technology. The chiller adopts a combination of metallized ceramics, lithography, and printed circuit boards. This not only improves the reliability of the refrigerator, but also increases the output and achieves miniaturization. ,miniaturization. Small-sized refrigeration devices have a device density of 15 pairs/cm2. Micro-refrigerated devices with a device density of 50 pairs/cm2 and cooling element