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一、引言我们已经知道,晶体振荡器在国防工程和人们的生活中有着广泛的应用。然而,晶体振荡器并不是十全十美的,特别是当工作频率在几百兆赫至几千兆赫时,晶体振荡器的核心元件——石英谐振器的制造遇到了困难:频率上不去了,因为工作频率与晶片的厚度成反比,要想提高工作频率,晶片就得做得很薄,例如基频为100MHz时,晶片的厚度仅有16.7微米,使用传统的工艺要使工作倾率再提高就相当困难了。而使用工作频率较低的晶体振振器,即使其指标很好,当倍至需要的工作频率时,往往因引入了倍频器的噪声而使
I. INTRODUCTION We already know that crystal oscillators have a wide range of applications in national defense projects and people’s lives. However, crystal oscillators are not perfect, especially when operating at frequencies from a few hundred megahertz to a few gigahertz - the manufacture of quartz resonators, the core component of the crystal oscillator, has encountered difficulties: the frequency is lost because work The frequency is inversely proportional to the thickness of the wafer. To increase the operating frequency, the wafer has to be very thin. For example, when the fundamental frequency is 100MHz, the thickness of the wafer is only 16.7μm. Using the traditional process, Difficult. The use of lower frequency crystal oscillator, even if its indicators are good, when the required operating frequency, often due to the introduction of the frequency multiplier noise