论文部分内容阅读
在电子工业中,广泛应用各种陶瓷材料,其中相当一部分(如铁氧体陶瓷)结构比较疏松,对于用这种材料作成的元器件的防潮问题国内很少有人作过系统的研究,传统的办法是将该材料的表面浸涂上一层有机聚合物簿膜。但因任何一种有机簿膜都有不同程度的透水、气的能力,致使疏松材料的防潮问题未能得到真正的解决。本文提出了在高真空条件下,将低分子量的有机单体(1,2-丁二烯的二聚体)浸入充分干燥过的陶瓷微孔内,以热(最好采用 r-射线照射)聚合方式用1,2-聚丁二烯填满陶瓷微孔这一新的途径。并为实验所证实。
In the electronics industry, a wide range of ceramic materials used, of which a considerable part (such as ferrite ceramics) structure is loose, for the use of this material made of moisture-proof components rarely made systematic research, the traditional The method is to dip the surface of the material coated with a layer of organic polymer film. However, due to any kind of organic membrane has varying degrees of permeability of water, gas capacity, resulting in moisture-proof materials loose material can not be a real solution. This paper proposes to immerse low molecular weight organic monomers (dimers of 1,2-butadiene) into well-dried ceramic micropores under high vacuum to heat (preferably by r-ray) Polymerization way With 1,2-polybutadiene to fill the ceramic pore this new way. And confirmed by the experiment.