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表面组装技术（ＳＭＴ）焊点的几何形态是影响焊点可靠性的重要因素之一。通过设计片式元件焊点的几何形态，制作热循环试件，考察焊点形态影响焊点热循环寿命的规律。热循环试验的规范为：温度范围－５５℃～＋１２５℃，升降温速率为３６℃／ｍｉｎ，恒温停留时间为１０ｍｉｎ。研究表明，高可靠性的ＳＭＴ焊点的钎料圆角形态应为平直形，元件与基板的间隙为－０１ｍｍ。研究结果对提高城堡形ＳＭＴ焊点的可靠性具有普遍意义。
Surface Mount Technology (SMT) The geometry of a solder joint is one of the important factors that affect solder joint reliability. By designing the geometries of the solder joints of the chip components, the thermal cycling test pieces were made and the regularity of the solder joint morphology affecting the thermal cycle life of the solder joints was investigated. Thermal cycling test specifications: temperature range -55 ℃ ~ +125 ℃, heating and cooling rate of 36 ℃ / min, the temperature dwell time was 10min. The research shows that the fillet shape of the solder joint with high reliability should be flat and the gap between the component and the substrate should be -0.1 mm. The research results have a universal significance to improve the reliability of cast-shaped SMT solder joints.