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文中以某机载电子设备振动试验中印制板(PCB)故障现象为研究对象,通过理论分析和ANSYS动力学计算的方法对PCB板产生故障的机理进行了分析和计算。计算结果与试验现象相符,认为谐振和PCB板设计问题是导致该试验故障的原因,并在结构接口方面对引起谐振的情况进行了分析,阐述了结构和电讯方面相应的改进措施。
In this paper, the fault phenomenon of printed circuit board (PCB) in the vibration test of an airborne electronic equipment is taken as the research object. The mechanism of PCB fault is analyzed and calculated through theoretical analysis and ANSYS dynamic calculation. The calculation results agree well with the experimental ones. It is considered that the resonance and PCB design problems are the causes of the test failures. The resonance caused by the structural interface is also analyzed. The corresponding improvements in the structure and telecommunications are described.