基于它的技术优势三维集成技术正在不断地被应用到新的产品中,也包括被应用到消费电子产品里。同时也对许多工艺提出了新的要求,其中也包括光刻和晶圆级键合。三维集成技术还是需要光刻工艺来完成图形的转换,为此,讨论了三维集成工艺对工艺设备和技术提出的挑战。介绍了SUSS公司与三维技术相关的产品。着重讨论与三维集成工艺相关的光刻和键合工艺。描述了三维集成对它们提出的挑战以及目前已有的解决方案和前景。并介绍一款新的具有0.25μm对准精度的接近接触式光刻机。 Based on its technical advantages, three-dimensional integration technology is constantly being applied to new products, including being applied to consumer electronics products. There are also new requirements for many processes, including lithography and wafer-level bonding. The three-dimensional integration technology still needs the photolithography process to complete the graphics conversion. Therefore, the challenges of the three-dimensional integration process to the process equipment and technology are discussed. Introduced SUSS 3D technology-related products. It focuses on the lithography and bonding processes associated with 3D integrated processes. Describes the challenges posed to them by 3D integration and the solutions and prospects that exist today. And introduces a new proximity-contact lithography machine with 0.25μm alignment accuracy.