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研究了Ni颗粒对Sn0.7Cu无铅钎料界面组织、铺展性能和显微硬度的影响规律。结果表明:适量Ni颗粒的加入不仅使基体中的Cu6Sn5弥散分布,还可以改变界面处金属间化合物(IMC)层的形貌,由原先延伸入基体中的针状转变为较为平缓整齐的贝壳状;当Ni含量超过0.05 wt%时,IMC表现出明显的长大趋势,最大厚度达2.463μm;铺展系数和显微硬度随Ni含量的增加表现出先增加后降低的趋势,Ni颗粒的最佳添加量为0.05 wt%。
The influence of Ni particles on the interface structure, spreading property and microhardness of Sn0.7Cu lead-free solder was studied. The results show that the proper addition of Ni particles not only disperses the Cu6Sn5 in the matrix, but also changes the morphology of the intermetallic compound (IMC) layer at the interface, which transforms from the acicular shape originally extended into the matrix into a relatively smooth and neat shell shape ; When the Ni content exceeds 0.05 wt%, IMC shows a clear trend of growth, the maximum thickness of up to 2.463μm; spreading coefficient and microhardness with the increase of Ni content first increased and then decreased, Ni particles the best addition The amount is 0.05 wt%.