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导热膏填充的接触界面热阻由接触热阻和间隙热阻两部分组成。本文采用截锥体接触的单热流通道模型代替CMY模型中的圆盘接触的单热流通道模型,推导出了改进的接触热阻计算公式。本文还结合间隙热阻的计算公式,得到了一种改进的导热膏填充的接触界面热阻模型。通过分析得出了如下结论:对于使用导热膏填充的接触界面的热阻而言,其主要影响因素为接触表面的粗糙度和导热膏的导热系数,而接触界面间压力对其的影响则相对较小。
Thermal paste filled contact interface thermal resistance by the thermal contact resistance and thermal resistance gap composed of two parts. In this paper, a single-hot-flow channel model with truncated conical contact is used to replace the single-hot-flow channel model with disc contact in the CMY model, and an improved contact resistance calculation formula is deduced. This paper also combined with the calculation formula of gap thermal resistance, obtained an improved thermal paste filled contact interface thermal resistance model. The main conclusions drawn from the analysis are as follows: For the thermal resistance of the contact interface filled with thermal paste, the main influencing factors are the roughness of the contact surface and the thermal conductivity of the thermal paste, while the influence of the contact interface pressure on it is relative Smaller.