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本文探讨采用小电极与大面积基片相对移动的方法来制造大面积薄膜的可行性,提出了采用小电极等离子体源在大面积基片上移动工作的新方法,可用于沉积(或刻蚀)均匀大面积薄膜或根据需求设计的大面积上非均匀膜厚分布的薄膜,从原理上避免大电极带来的不均匀性。介绍了这种方法中由两个电极构成的等离子体增强化学气相沉积(PECVD)系统。分析了当电极移动时,电极与真空室壁相对位置发生变化时对等离子体参数的影响。我们发现当两个射频电极之间的相位差为定值时,等离子体的分布随电极与真空室壁的距离(极地距)变化而变化。当极地距小于80mm时,随极地距的增加,等离子体的悬浮电位和基片的自偏压下降,离子密度变化不明显。当极地距大于80mm时,等离子体的分布呈稳定状态,各参数变化不明显。采用PECVD方法镀制了大面积薄膜厚度呈均匀分布和非均匀分布的两种薄膜,提供了膜厚呈线性渐变和抛物线变化的两种薄膜样片,显示了该方法的灵活性和可行性。
In this paper, we discuss the feasibility of using large electrode and large area substrate to make a large area thin film. A new method using small electrode plasma source to move a large area substrate is proposed. It can be used for deposition (or etching) Uniform large-area film or on-demand design of non-uniform film thickness distribution on a large area, in principle, to avoid the uneven electrode caused by large. A plasma enhanced chemical vapor deposition (PECVD) system consisting of two electrodes in this method is described. The influence of the relative position of the electrode and vacuum chamber on the plasma parameters was analyzed when the electrode was moved. We found that when the phase difference between the two RF electrodes is constant, the plasma distribution varies with the distance between the electrode and the walls of the vacuum chamber (polar distance). When the polar distance is less than 80mm, with the increase of the polar distance, the plasma potential and the substrate self-bias voltage drop, the ion density does not change significantly. When the polar distance is more than 80mm, the plasma distribution is stable, and the change of each parameter is not obvious. The PECVD method was used to fabricate two kinds of thin films with uniform and non-uniform distribution of film thickness. Two types of thin film samples with linear gradient and parabola change were provided, which showed the flexibility and feasibility of the proposed method.