随着器件尺寸进入到微 /纳米尺度 ,其热物性与体材料相比有了很大差别。在器件热性能和可靠性研究过程中 ,对热导率的测量成为了关键技术之一。本文概述了SiO2 、SiNx、金刚石等薄膜在微小型器件中的用途及其热导率测试技术的发展 ,并进一步总结了用于薄膜热导率测量的常用方法 With the device size into the micro / nano-scale, its thermal properties and body materials have been very different. In the study of device thermal performance and reliability, the measurement of thermal conductivity has become one of the key technologies. This paper presents an overview of the use of SiO2, SiNx, diamond and other thin films in micro-devices and the development of their thermal conductivity testing techniques, and further summarizes the commonly used methods for the thermal conductivity measurement of thin films