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散热不良导致的热失效是电子设备失效的主要形式,而微通道液冷冷板具有较高的换热效率。使用专业流体热仿真软件CFX分析相同边界条件下不同结构参数微通道冷板的热效性能,寻求最优设计方案。
Thermal failure caused by poor heat dissipation is the main form of electronic equipment failure, while the microchannel liquid cold plate has a higher heat transfer efficiency. The thermal performance of microchannel cold plates with different structural parameters under the same boundary conditions was analyzed by CFX, a professional fluid thermal simulation software to find the optimal design scheme.