本文研究了Sialon陶瓷与40Cr钢活性钎焊连接中缓冲层的作用.结果发现:缓冲层材料本身可能影响活性钎料与陶瓷的界面连接强度,对Ag_(57) Cu_(38) Ti_5活性钎料,Cu和Ta是较好的缓冲层材料,而对 Kovar,Ni-15 Cr-15Co则较差;用软性缓冲层如 Cu来松弛应比用硬性缓冲层如Mo来避免应力更加重要;软性缓冲层有一个合适的厚度范围,其h/L≈0.02—0.1;采用软/硬复合缓冲层可以有效的提高接头强度。最后作者提出了设计梯度材料作为专用缓冲层材料的设想。 In this paper, the effect of the buffer layer on the active brazing connection between Sialon ceramic and 40Cr steel was studied. The results show that the buffer layer itself may affect the interfacial bonding strength between the active brazing filler metal and the ceramic, , Cu and Ta are better buffer materials, whereas for Kovar, Ni-15 Cr-15Co is poorer; relaxing with a soft buffer such as Cu should be more important than avoiding stress with a hard buffer such as Mo; soft The buffer layer has a suitable thickness range, its h / L ≈ 0.02-0.1; soft / hard composite buffer layer can effectively improve the joint strength. Finally, the author proposed the design of gradient material as a special buffer layer material.