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最近,Sonoscope公司研制成一种扫描激光声显微镜(SLAM),它真实地把芯片与基片之间焊接处显示出来。SLAM发送一束高频声波通过电路,让基片、焊剂和芯片内部结构形成声图,然后用He-Ne激光以每秒30次速度探测声图,并显示在荧光屏上进行直接观察。SLAM级是一块10in~2的黑表面。隐藏在级内是LiNbO_3换能器。工作时,在换能器上滴上几滴氟利昂耦合液,然后放上要检测的样品,再在它的顶上滴上几滴耦合液。因为空气
Recently, Sonoscope developed a scanning laser acoustic microscope (SLAM) that virtually displays the bond between the chip and the substrate. SLAM transmits a high-frequency sound wave through the circuit to create a sound image of the substrate, flux and internal structure of the chip, and then the sound image is detected with a He-Ne laser at a rate of 30 times per second and displayed on the screen for direct observation. SLAM level is a black surface of 10in ~ 2. Hidden in the class is the LiNbO_3 transducer. In operation, drop a few drops of Freon coupling fluid on the transducer, place the sample to be tested, and drop a few drops of coupling solution on top of it. Because of the air