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为减少传统工艺制备的钨/铜薄板在压力加工过程中产生过多缺陷,提高板材的力学和电学性能,设计了一种新型的具有Cu/WCu/Cu三明治结构的超薄板,对比分析了两种结构板材在轧制过程中组织和性能的变化。结果表明:与传统结构试样相比,三明治结构试样表面覆铜层能够完成对基体表层钨颗粒的包覆和孔隙的填充,进而实现表面改性;三明治结构试样在轧制过程中产生缺陷相对较少,加工硬化不明显,抗拉强度和导电性能也优于传统试样。
In order to reduce the excessive defects of the tungsten / copper sheet prepared by the traditional process and improve the mechanical and electrical properties of the sheet, a new type of ultra-thin sheet with a Cu / WCu / Cu sandwich structure was designed and compared Changes of Structure and Properties of Two Structural Plates During Rolling. The results show that, compared with the traditional structural specimens, the copper claddings on the surface of the sandwich structure can finish the coating of the tungsten particles on the surface of the matrix and the filling of the pores, thereby realizing the surface modification; the sandwich structure specimens are produced during the rolling process Defects are relatively small, work hardening is not obvious, tensile strength and electrical conductivity is also better than the traditional sample.