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简述MCM(多芯片模块)向SiP(封装内系统)发展的过程,依托系统集成技术和微电子封装技术,阐述MCM/SiP技术在宇航产品及武器装备计算机研制中的应用与发展,并分析了系统级封装涉及的关键技术及其应用情况。
The process of developing MCM (multi-chip module) to SiP (package system) is briefly described. Based on system integration technology and microelectronic package technology, the application and development of MCM / SiP technology in the development of aerospace products and weapon equipment computer are described and analyzed The key technologies involved in system-in-package and their applications.