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零偏和标度因数稳定性是衡量加速度计性能的两个重要参数.为了降低硅微谐振式加速度计的温度敏感性,对其温度影响机理进行了深入研究.通过温度实验发现,硅微谐振式加速度计的零偏和标度因数与设计理论参数有较大区别,且都具有较大的温度灵敏度,分别为0.72 g/℃和1.5℃-1.对弹性模量和谐振器应力与谐振器频率的关系进行了理论计算和FEA仿真验证,其中弹性模量引起的谐振频率-温度灵敏度为-0.7 Hz/℃,谐振器应力引起的谐振频率-温度灵敏度为180 Hz/℃.阐述了加工过程中键合应力产生的原因以及键合应力与谐振器残余应力的关系,发现谐振器应力是造成加速度计输出随温度漂移的主要因素.提出了一种隔离残余应力的隔离梁的设计方案,可使零偏温度灵敏度降至-35 Hz/℃,为温度补偿指明了方向.
Zero-bias and scaling factor stability are two important parameters to measure the performance of accelerometer.In order to reduce the temperature sensitivity of the silicon microresonance accelerometer, the mechanism of its temperature effect is studied in depth.It is found from the temperature experiment that the silicon microresonance The bias and scaling factors of the accelerometer are quite different from those of the design theory, and have large temperature sensitivities of 0.72 g / ℃ and 1.5 ℃ -1, respectively. For the elastic modulus and resonator stress and resonance The relationship between the frequency of the resonator and the frequency of the resonator is verified by theoretical calculation and FEA simulation, in which the resonant frequency - temperature sensitivity caused by elastic modulus is -0.7 Hz / ℃ and the resonant frequency caused by resonator stress - the temperature sensitivity is 180 Hz / ℃. The reason of the bond stress and the relationship between the bond stress and the residual stress of the resonator are found, and it is found that the resonator stress is the main factor that causes the output of the accelerometer to drift with temperature. A design scheme of the isolated beam with residual stress is proposed, Zero bias temperature sensitivity can be reduced to -35 Hz / ℃, indicating the direction of temperature compensation.