Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joi

来源 :Acta Metallurgica Sinica(English Letters) | 被引量 : 0次 | 上传用户:zou123456ting
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With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer’’ were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature. With the use of Ti / Ni / Cu / Ni multiple foils as interlayer, carbon / carbon (C / C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique. The effect of bonding temperature on the microstructures and strengths of the joints was investigated. The results showed that gradient structural multiple interlayers composed of ’C-Ti reaction layer / Ti-Ni intermetallic compound layer / Ni-Cu sosoloid / residual Cu layer / Ni-GH3044 diffusion layer’ were formed between C / C composite and GH3044. The shear strength of the C / C composite / GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 ° C. In addition, the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.
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