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石英晶体器件用金属壳冷压焊封装是较为先进的一种工艺,但这种工艺只有在利用复合材料的情况下才比较易于实现。本文介绍了采用北京治金研究所新近研制的复合材料——复铜可伐4J29—Cu制造底座的优点(与老式锡焊绝缘子过渡的工艺相比较),及对材料进行的一系列试验,特别是对试验样品进行的较全面的例行试验。这些试验条件是和空间电子设备试验条件相一致的。试验表明,4J 29—Cu新材料具有良好的冷压特性和加工性,冷压焊后焊缝有良好的密封性,是制造冷压焊封装的中或高精密石英晶体器件底座较理想的材料。
Quartz crystal device using cold-pressed metal shell package is a more advanced technology, but this process is only in the case of the use of composite materials is relatively easy to achieve. This article describes the advantages of using the newly developed composite material of the Beijing Institute of Metallurgy - CoCu 4J29-Cu base (compared with the transitional process of the old soldered tin insulator) and a series of tests on the material, in particular Is a more comprehensive routine test of the test sample. These test conditions are consistent with the test conditions for space electronics. The tests show that the 4J 29-Cu new material has good cold-press characteristics and processability. The weld seam after cold-press welding has a good sealing performance and is an ideal material for manufacturing a cold-pressed welded medium- or high-precision quartz crystal device base .