全球集成电路产业正进入重大调整变革期,整个产业链技术突飞猛进,向高端领域发展势在必行。在芯片封装领域,随着用户对电子系统或电子整机的要求日益高涨,电子系统或电子整机正在朝多功能、高性能、小型化、轻型化、便携化、高速度、低功耗和高可靠方向发展。目前我国已形成集成电路设计、晶圆制造和封装测试三业并举的发展格局,封测产业链的技术含量越来越高,在集成电路产品的成本中占比也日益增加。业内领先的企业长电科技、 The global integrated circuit industry is entering a period of major adjustments and changes. The technology in the entire industry chain has been advancing by leaps and bounds and the development of high-end fields is imperative. In the field of chip packaging, with the increasing demands of users on electronic systems or electronic devices, electronic systems or electronic devices are moving towards multifunction, high performance, miniaturization, light weight, portability, high speed, low power consumption Highly reliable direction of development. At present, China has formed a pattern of integrated development of integrated circuit design, wafer manufacturing and package testing. The technological content of IC packaging and testing industry chain is getting higher and higher, accounting for an increasing proportion of the cost of integrated circuit products. Industry leader in long-technology,