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为了保证表面贴装电子产品的质量,对表面贴装工艺的核心环节回流焊的工艺特点进行了分析,讨论了回流焊的温度曲线特点和影响回流焊焊接质量的几个主要因素,并根据回流焊的温度和工艺特点对回流焊焊接过程中出现的立片、桥连、芯吸、空洞、锡球、PCB扭曲、IC引脚焊后开路等几种常见的焊接缺陷及其成因进行了分析,提出了相应的解决对策。通过这些措施,有效的降低了焊接缺陷的出现率,提高了回流焊的焊接质量。
In order to ensure the quality of surface mount electronic products, the core process of surface mount process reflow soldering process characteristics are analyzed, the characteristics of the reflow soldering temperature curve and the impact of reflow soldering quality of several major factors, and according to the return Soldering temperature and process characteristics of the reflow soldering process appear piece, bridge, wick, hole, solder ball, PCB twist, IC pin open after welding several common welding defects and their causes were analyzed , Put forward the corresponding solutions. These measures effectively reduce the occurrence of welding defects and improve the quality of reflow soldering.