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前言 国内微电子市场的持续增长,以及中国加入WTO,吸引了世界半导体产业界和投资者的关注,“十五”期间我国集成电路及半导体产业将有更大的发展,这些都为我国微电子配套材料的发展提供了难得的机遇。为改变我国集成电路产业用关键基础材料技术水平低、品种不配套、产业化规模小、关键基础材料依赖进口的局面,科技部在“十五”国家863计划中,特别设立微电子配套材料重大专项,选择重点,坚持有所为,有所不为,以自主开发、突破关键技术和加强成果的产业化为目标,在
Preface The continuous growth of the domestic microelectronics market, as well as China’s accession to the WTO, has attracted the attention of the world’s semiconductor industry and investors. During the “Tenth Five-year Plan” period, China’s integrated circuits and semiconductor industry will have greater development. All of these are for our microelectronics The development of supporting materials provides a rare opportunity. In order to change the low technology level of key basic materials for IC industry in China, the varieties are not suitable, the scale of industrialization is small and the key basic materials are dependent on imports, the Ministry of Science and Technology specially set up the microelectronics supporting materials in the Tenth Five-Year National 863 Plan Special, select the key, insist on doing something, not doing something, with independent development, breakthroughs in key technologies and enhance the industrialization of the results as the goal, in