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采用电阻钎焊对厚度较大的铜板U型对接接口进行了焊接,分析了焊接结构对钎焊钎着率、焊缝微观组织的影响。结果表明,电阻钎焊可以将焊缝周围的母材整体加热,易于钎料的整体填充焊缝,钎着率高于火焰钎焊。电阻钎焊时在钎焊缝周围预置焊料槽可以有效地补充钎焊缝,有利于气体的排出和钎剂残渣的上浮,大大降低了气孔的产生和钎剂残渣的残留。钎着率达到95%,钎焊缝连续均匀,无明显的缺陷,钎焊接头抗拉强度达到202 MPa,接近T2母材的强度。
Resistance brazing was used to weld U-shaped butt joint of copper plate with larger thickness. The influence of welding structure on brazing rate and microstructure of weld was analyzed. The results show that the resistance brazing can heat the whole base metal around the weld, and it is easy to fill the weld with the brazing filler. The brazing rate is higher than that of the brazing. During the brazing process, the brazing seam is preset with the solder groove to effectively replenish the brazing seam, which is favorable for gas discharge and flux residue floating, which greatly reduces the generation of stomata and residue of the flux residue. The brazing rate reaches 95%, the brazing seam is continuous and uniform, with no obvious defects. The tensile strength of the brazed joint reaches 202 MPa, which is close to the strength of the T2 parent material.