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双槽电沉积法制备了不同调制波长的Cu/Ag金属多层膜(Cu膜和Ag膜等厚),用扫描电子显微镜观察了多层膜的层状结构,并研究了不同调制波长下多层膜的显微硬度变化。结果表明:双槽电沉积法制备的Cu/Ag多层膜层状结构明显。当调制波长大于100 nm时,显微硬度随调制波长减小而增加;当小于100 nm时,硬度随调制波长减小而降低;调制波长为100 nm时,显微硬度取得最大值,为150HV。
Cu / Ag multilayers with different modulation wavelength (Cu film and Ag film) were prepared by double-cell electrodeposition method. The lamellar structure of multilayers was observed by scanning electron microscopy. The effects of different modulation wavelength The changes in the microhardness of the film. The results show that the layered structure of Cu / Ag multilayers prepared by double-cell electrodeposition is obvious. When the modulation wavelength is greater than 100 nm, the microhardness increases with the decrease of the modulation wavelength. When the modulation wavelength is less than 100 nm, the hardness decreases with the modulation wavelength. When the modulation wavelength is 100 nm, the microhardness reaches the maximum value of 150 HV .