有化学反应性的等离子体低压辉光放电,已被用于微电子电路制造中一些涂层材料的形成。等离子体反应最主要的优点是其通常在温度远低于热反应可能发生的温度下进行,因此有可能在热稳定性差而不能进行高温淀积的衬底上淀积或生长薄膜。这一特点;不管从对金属互连线的钝化膜淀积的要求来看,还是从在 Chemically reactive plasma low voltage glow discharge has been used to form some coating materials in the manufacture of microelectronic circuits. The most important advantage of the plasma reaction is that it is usually carried out at a temperature well below the temperature at which thermal reactions can occur, making it possible to deposit or grow thin films on substrates that are poorly thermally stable and can not be deposited at elevated temperatures. This feature; no matter from the metal interconnection line passivation film deposition requirements, or from