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研究了时效时间对Cu-0.2Be-0.5Co合金显微硬度和导电率的影响,采用透射电子显微镜(TEM)观察分析了微观组织随时效时间的变化。结果表明:Cu-0.2Be-0.5Co合金在460℃时效条件下显微硬度和导电率随时效时间的变化规律基本一致:时效初期(0~2 h)急剧升高,时效中期(2~4 h)缓慢增加,时效后期(4~8 h)趋于稳定。析出相结构为Be12Co化合物相,与Cu基体的位向关系为[112]α∥[011]Be12Co。析出相的大量析出和弥散分布导致合金硬度的显著增加,由固溶态的97 HV0.1增加至时效2 h后的243 HV0.1;铜基体晶格畸变程度的恢复导致合金导电率显著增加,由固溶态的32.3%IACS增加至时效2 h后的57.1%IACS。在试验范围内,Cu-0.2Be-0.5Co合金经950℃×1 h固溶+460℃×2 h时效处理后综合性能优良。
The effects of aging time on the microhardness and electrical conductivity of Cu-0.2Be-0.5Co alloy were studied. The changes of microstructure with aging time were observed by transmission electron microscope (TEM). The results show that the microhardness and electrical conductivity of Cu-0.2Be-0.5Co alloy are basically the same with the aging time under the condition of 460 ℃ aging: the initial aging (0-2 h) h) slowly increased, late aging (4 ~ 8 h) tends to be stable. The precipitated phase structure is Be12Co phase, and the orientation relationship with Cu matrix is [112] α∥ [011] Be12Co. The large precipitation and dispersion distribution of the precipitated phase lead to a significant increase in the hardness of the alloy, from 97 HV0.1 in solid solution state to 243 HV0.1 after 2 h aging. The recovery of the degree of lattice distortion of the copper matrix results in a significant increase in the electrical conductivity of the alloy , From 32.3% IACS in solid solution to 57.1% IACS after 2 h aging. Within the experimental range, the Cu-0.2Be-0.5Co alloy has good comprehensive properties after being treated by 950 ℃ × 1 h solid solution + 460 ℃ × 2 h aging treatment.