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随着电子工业的飞速发展,半导体专用设备不断地更新,近年来我所研制的内圆切片机,得到部、局和使用厂家的好评。该机关健部件静压轴承是十分精密的,其核心零件轴承动圈,属于大直径高精度高光洁度的零件,经过近两年的探讨与实践,对加工工艺和加工技术进行了改进,研究出了新的抛磨方法,获得了高精度高光洁度的轴承动圈。下面以该零件为例,介绍工艺的改进和抛磨技术。 一、零件的精度要求 轴承动圈是铬钼铜铸铁件,重约15公斤,外形尺寸为φ278_(-0.242)~(-0.1),该零件尺寸精度、形位公差、光洁度要求较高,尤其是内孔
With the rapid development of the electronics industry, the semiconductor equipment is continuously updated. In recent years, the internal slicing machine developed by our company has been well received by the ministries, bureaux and manufacturers. The machine parts health hydrostatic bearing is very sophisticated, and its core parts bearing dynamic, belonging to the large diameter high-precision high-finish parts, after nearly two years of exploration and practice of the processing technology and processing technology has been improved to study out A new polishing method, obtained high-precision high-precision bearing dynamic. The following parts to an example, describes the process improvement and polishing technology. First, the accuracy of the parts required Bearing dynamic is chromium molybdenum copper cast iron, weighing about 15 kg, dimensions φ278 _ (- 0.242) ~ (-0.1), the parts dimensional accuracy, shape tolerances, finish demanding, in particular Is the hole