采用浸渍法以缓蚀剂氨基三亚甲基膦酸(ATMP)为原料、添加剂烷基酚聚氧乙烯醚(APEO)和卤素钾盐的水溶液为封孔剂溶液在镍钯金电路板(PCB-ENEPIG)表面自组装形成有机皮膜。通过电化学阻抗谱(EIS)、扫描电镜研究了该有机保护膜的耐腐蚀性能及其形貌。实验结果表明:有机自组装膜对PCB-ENEPIG有较好的耐蚀作用,采用1.5 g/L ATMP、10 g/LAPEO、1 g/L碘化钾得到的自组装膜耐腐蚀性能最佳。 Using impregnation method, aminotrimethylene phosphonic acid (ATMP) as the raw material, an aqueous solution of the additive alkylphenol polyoxyethylene ether (APEO) and the halogenated potassium salt as a sealer solution were prepared on a nickel-palladium gold circuit board (PCB- ENEPIG) surface self-assembly to form organic membrane. The corrosion resistance and morphology of the organic protective film were investigated by electrochemical impedance spectroscopy (EIS) and scanning electron microscopy (SEM). The experimental results show that the organic self-assembled film has good corrosion resistance to PCB-ENEPIG. The self-assembled film obtained with 1.5 g / L ATMP, 10 g / L APEO and 1 g / L potassium iodide has the best corrosion resistance.