逻辑用的集成电路和存储用的集成电路的集成度,每年大约以1.5～2的比例急剧地发展。与此同时,收容这些集成电路的外壳,布线基板,印刷布线等,即使在所谓的装配部件中,接点连接法,电路间的布线法,以及从集成电路发生的热的消除法等,各种装配技术的研究也在积极地进行着。把集成电路安装在布线基板上的方 The level of integration of logic integrated circuits and memory integrated circuits has been rapidly increasing by about 1.5 to 2 per year. At the same time, the housings, the wiring boards, the printed wiring and the like that house these integrated circuits are widely used in various applications such as so-called mounting parts, contact connection methods, inter-circuit wiring methods, and heat elimination methods from integrated circuits Research on assembly technology is also actively carried out. Place the integrated circuit on the wiring board