2015年5月22日,深圳长电科技有限公司召开2015年度锂电MOSFET系列新品发布会,宣布推出DFN2×3、CSP系列新品。深圳长电科技总经理杨国江、副总经理范荣定出席了本次发布会,业界相关企业和人士参加了发布会。新推出的DFN2×3封装产品具有相比DFN3×3封装产品,具有尺寸更小、有利缩减PCB宽度的优势,另外还具有贴片工艺简单、整体成本低、不易破裂、焊接工艺成熟和管脚排列简单,PCB设计布线简洁等五大优势,该产品拥有CJCD2003、CJCD2004、CJCD2005、CJCD2006、CJCD2007等多种型号。CPS产品虽然存在易碎、贴片工艺复杂和电教需要人工及成本等方面的不 On May 22, 2015, Shenzhen Changdian Technology Co., Ltd. held a 2015 new lithium-ion MOSFET series conference and announced the launch of DFN2 × 3 and CSP series of new products. Yang Guojiang, general manager of Shenzhen Changjiang Electronics Technology Co., Ltd. and Fan Rongding, the deputy general manager, attended the conference and related enterprises and individuals in the industry attended the conference. Compared with the DFN3 × 3 package, the new DFN2 × 3 package has the advantage of smaller size and reduced PCB width. In addition, it has the advantages of simple chip process, low overall cost, not easy to crack, mature welding process and pin Simple arrangement, PCB design and wiring simple five advantages, the product has CJCD2003, CJCD2004, CJCD2005, CJCD2006, CJCD2007 and other models. Although CPS products are fragile, complex patch technology and audio-visual education requires labor and cost, etc.