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采用一次成膜和程序升温法,制备了以聚酰亚胺为基底的氧化铝新型磨片(Al2O3/PI),可用于硬脆性机件表面的精加工和抛光。扫描电镜(SEM)显示,Al2O3/PI磨片为双层膜型,磨料层厚度约50μm,基底厚度约150μm。差热分析(DSC/TGA)、拉伸强度和断裂伸长率测试表明显示,Al2O3/PI磨片的热分解温度大于500℃,并具有PI膜的高强度和良好的柔韧性。对磨片制备过程的主要影响因素及铜片的抛光效果进行了讨论。
A new type of alumina based plate (Al2O3 / PI) based on polyimide was prepared by one-step film-forming and temperature-programmed method, which can be used for the finishing and polishing of hard and brittle parts. Scanning electron microscopy (SEM) showed that the Al2O3 / PI flake was a bilayer membrane with an abrasive layer thickness of about 50 μm and a substrate thickness of about 150 μm. Differential scanning calorimetry (DSC / TGA), tensile strength and elongation at break test showed that the thermal decomposition temperature of Al2O3 / PI flake was higher than 500 ℃, and the PI film had high strength and good flexibility. The main factors affecting the process of grinding and the polishing effect of copper are discussed.