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利用自制的抛光液对高纯镍片进行化学机械抛光,研究化学机械抛光过程中抛光压力、pH值、H2O2浓度、络合剂种类及其浓度、SiO2浓度等参数对抛光速率的影响。结果表明在抛光压力为13.79kPa、H2O2浓度为0.5%,pH值为3.0,SiO2浓度为0.5%,络合剂EDTA及其浓度为1%时,得到最大抛光速率为312.3nm/min;在抛光压力为13.79kPa、pH值为4.0、SiO2浓度为1%、络合剂EDTA为1%、H2O2浓度为1%条件下抛光得到的镍片表面质量较好,表面粗糙度Ra达到5nm。并利用电化学手段研究了镍片在抛光液中的溶解与钝化行为。
The effects of polishing pressure, pH value, H2O2 concentration, complexing agent type and concentration, SiO2 concentration and other parameters on the polishing rate were studied by chemical mechanical polishing of high purity nickel flake with a homemade polishing solution. The results showed that the maximum polishing rate was 312.3nm / min at the polishing pressure of 13.79kPa, H2O2 concentration of 0.5%, pH value of 3.0, SiO2 concentration of 0.5% and complexing agent EDTA and its concentration of 1% The pressure of 13.79kPa, the pH value of 4.0, SiO2 concentration of 1%, complexing agent EDTA is 1%, H2O2 concentration of 1% under the conditions of polishing the nickel surface quality is better, the surface roughness Ra reaches 5nm. The dissolution and passivation behaviors of nickel flake in polishing solution were studied by electrochemical method.