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台积电近期公布了该公司2011年的资本预算为26.9亿美元。主要用于12英寸晶圆厂与晶圆封装(WLCSP,Wafer-Level Chip-Scale Packaging)两大业务。为抓住科技产品“轻薄短小”的趋势,台积电业务从上游晶圆代工扩大到下游的晶圆封装。
TSMC recently announced the company’s 2011 capital budget of 2.69 billion US dollars. Mainly used in 12-inch wafer fab and wafer packaging (WLCSP, Wafer-Level Chip-Scale Packaging) two major businesses. In order to seize the trend of technology products “light and thin ”, TSMC expanded from the upstream foundry to the downstream wafer packaging.