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采用高能球磨的机械合金化法合成Sn-Cu二元合金超细粉体,对在球磨过程中粉体的结构演变、颗粒形貌、粒径分布及熔化特性进行了研究,讨论了合金化机制。结果表明:球磨粉体由Sn(Cu)过饱和固溶体及Cu6Sn5构成。在球磨初期,Cu、Sn颗粒相互迭加、冷焊,形成复合层块;随后,复合层块断裂碎化,球形颗粒相互团聚构成大的团粒;最后,团粒解散,小颗粒进一步细化。球磨60h后,Sn-Cu合金粉体的平均粒径(d50)为1～3μm,且随Cu含量由0.7wt%增加到10wt%,Sn-Cu合金粉颗粒形貌由不规则绒絮状变化到球状,熔点由231℃降低到288℃。
Sn-Cu binary alloy superfine powder was synthesized by mechanical alloying method of high energy ball milling. The structure evolution, particle morphology, particle size distribution and melting characteristics of the powder during ball milling were studied. The effects of alloying mechanism . The results show that the ball mill consists of supersaturated solid solution of Sn (Cu) and Cu6Sn5. At the initial stage of ball milling, the Cu and Sn particles are superposed on each other and are cold-welded to form a composite layer. Subsequently, the composite layer breaks and fragrates, and the spherical particles agglomerate with each other to form a large agglomeration. Finally, the agglomerates are dissolved and the small particles are further refined. After milling for 60h, the average grain size (d50) of Sn-Cu alloy powders was 1 ~ 3μm, and the content of Cu increased from 0.7wt% to 10wt%. The morphology of Sn-Cu alloy powders varied from irregular fluff To spherical, melting point from 231 ℃ to 288 ℃.