融合并不是什么特别新奇的概念。早在数年前,就已经有很多PC厂商提出了计算(Computing)、通信(Communicate)以及消费类电子产品(CE)之间的融合,这也是当时经常在媒体上出现的3C的概念。尽管英特尔在本次IDF大会上的主题也是融合,但其内函已经发生了实质上的变化,英特尔所提出的融合更加基础,它是从硅晶片这个角度实现融合,而不再是当初的设备或者部件级的融合。 Fusion is not a particularly novel concept. As early as a few years ago, many PC makers had proposed the convergence of computing, communications and consumer electronics (CE), a concept that was often found in the media at the time. Although Intel’s theme at this IDF conference is also amalgamating, but its letter has already undergone a substantive change, the fusion that Intel proposed is more foundation, it is to realize the integration from the silicon wafer’s point of view, and is no longer the original equipment Or component-level integration.