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新型MEMS应用领域的发展为现有的制造技术带来了很大的挑战,并促使了满足新加工要求的制造能力的发展。根据目前MEMS制造中普遍采用的不同的晶圆键合方法及其主要工艺参数要求,开发了一种新型的晶圆键合技术。
The development of new MEMS applications poses significant challenges to existing manufacturing technologies and has led to the development of manufacturing capabilities that meet new processing requirements. According to the different wafer bonding methods commonly used in MEMS manufacturing and their main process parameters, a new type of wafer bonding technology has been developed.