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集成电路(IC)装备工艺腔室内流场的均匀性是影响镀膜质量的关键因素。本文通过控制真空腔室入口处N_2流量(140,230,320 mL/min(标准状态))和出气口处压强值(36,45,55 Pa)来设置实验,采用压力管法测量低压腔室内任一点的压强值和薄膜规直接测量腔壁、出气口的压强值来实现腔室内压强分布的研究和压差的测量。讨论了腔壁与出气口之间的压差对压力管法的测量误差的影响;选择了二级匀气装置对进入腔室内的气体进行布气,通过比较腔室内同一水平面上各点与出气口之间的压差是否恒定来分析二级匀气盘的匀气效果。试验研究发现:在距离腔室中心150 mm的范围内,二级匀气装置的布气效果明显;本文采用的压力管法测量腔室内压强的误差与腔室进气量和腔室内流速存在内在联系。研究结果对IC装备设计及工艺控制有一定的指导意义。
The uniformity of the flow field in the integrated circuit (IC) equipment chamber is a key factor that affects the quality of the coating. In this paper, the experiment was set up by controlling the N 2 flow (140,230,320 mL / min (standard state)) at the inlet of the vacuum chamber and the pressure at the outlet (36,45,55 Pa). The pressure pipe method was used to measure the pressure at any point in the low pressure chamber Value and film gauge directly measure the pressure value of the cavity wall, the outlet to achieve the pressure distribution in the chamber and pressure measurement. The influence of the pressure difference between the cavity wall and the air outlet on the measurement error of the pressure tube method was discussed. The second-level air-entraining device was chosen to conduct gas into the chamber. By comparing the points on the same level in the chamber with The pressure difference between the port is constant to analyze the second air plate uniform air effect. The experimental results show that the air distribution effect of the second-level air-entraining device is obvious within the range of 150 mm from the center of the chamber. The error of the pressure in the chamber measured by the pressure tube method in this paper is inherently related to the air intake in the chamber and the flow velocity in the chamber contact. The research results have certain guiding significance for IC equipment design and process control.