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无凸点叠层(BBUL)封装技术是Intel公司研制出的1种新型封装技术,用以满足未来微处理器封装技术的要求。这种BBUL封装技术具有巨大的优越性,它免除了大多数高性能的倒装芯片所用的大量焊料凸点和互连,使环路电感量小、热机械应力小,不但减小芯片连接的寄生效应,而且提高了微处理器芯片的效率。此外,该封装的体积比传统封装更小、更轻,使多芯片之间的互连更为紧密。特别适合于高引出端的电子类及光电子产品,如逻辑单元、存储器、射频器件以及微型机电一体化系统。本文主要从其发展背景、工艺及特性方面阐述这种新型BBUL封装技术,最后提出一些建议。
Bumpless bumping (BBUL) packaging technology is Intel Corporation developed a new type of packaging technology to meet the future requirements of the microprocessor package technology. This BBUL packaging technology offers tremendous benefits by eliminating the large number of solder bumps and interconnects used in most high-performance flip-chips, minimizing loop inductance, reducing thermal mechanical stress and reducing die attach Parasitic effects, but also improve the efficiency of the microprocessor chip. In addition, the package is smaller and lighter than the traditional package, making the interconnections between multiple chips even tighter. Particularly suitable for high-end electronic and optoelectronic products, such as logic cells, memory, radio frequency devices and micro-mechatronic systems. This article mainly expounds the new BBUL packaging technology from its development background, technology and characteristics, and finally puts forward some suggestions.