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以康铜、镍不同厚度的薄膜，陶瓷Ａｌ２Ｏ３基组成微电子组件模型，在热载作用下，通过试验观察到薄膜在界面处的分层和屈曲失效。测量了分层和屈曲高度随载荷变化规律、过屈曲初始裂纹扩展。用屈曲理论和分界面能量释放率等理论进行了分析。
The model of the microelectronic module was made with different thicknesses of copper, nickel and ceramic Al2O3. Under the action of thermal load, the delamination and buckling failure of the film at the interface were observed. The stratification and buckling height were measured with the variation of load and the initial crack propagation during over-flexion. Buckling theory and interface energy release rate theory were analyzed.