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以2种不同硬基底和相同软薄膜构成的2种软膜硬基系统为对象,利用ABAQUS软件仿真,分别研究了σr/σy=-1、0、1时纳米压痕过程中不同基底对薄膜弹塑性变形以及力学性能的影响,并以与薄膜同材料的块体试样作为参考。结果表明,同一试样的hf/hmax在σr/σy=-1时较σr/σy=0时减小,随压深的增加而近似线性增大;σr/σy=1时hf/hmax较σr/σy=0时增大,且随压深的增大轻微的线性减小,基底的弹性模量越大,hf/hmax越大。σr/σy=0时试样均出现sink-in现象,σr/σy=1时sinkin加剧而σr/σy=-1时出现pile-up,随着压深的增加,两种应力状态下的sink-in或pile-up均有所减弱;基底的弹性模量越大,hc/hmax越大。
Two kinds of soft-film hard-base systems consisting of two kinds of hard substrates and the same soft film were used as object. By using ABAQUS software simulation, the effects of different substrate-to-film Elastic-plastic deformation and mechanical properties, and the same material with the film sample block as a reference. The results show that the hf / hmax of the same sample decreases when σr / σy = -1, and increases linearly with the increase of pressure depth. The hf / hmax of σr / σy = / σy = 0, and decreases linearly with the increase of pressure depth. The larger the elastic modulus of the substrate, the larger the hf / hmax. Sink-in phenomenon occurs when σr / σy = 0, sink-in increases when σr / σy = 1 and pile-up when σr / σy = -1. -in or pile-up weakened; the greater the elastic modulus of the substrate, hc / hmax greater.