论文部分内容阅读
研制出光谱响应为0.9～1.7μm的256×1、512×1元InGaAs线列焦平面组件,和光谱响应延展至2.4μm的256×1元InGaAs线列焦平面组件。焦平面组件包括光敏芯片、读出电路、热电制冷器以及管壳封装。光敏芯片在InP/InGaAs/InP(p-i-n)双异质结外延材料上采用台面结构实现,并与128×1或512×1元CTIA结构的读出电路耦合。焦平面器件置于双列直插金属管壳中,采用平行缝焊的方式进行封装。介绍了高均匀性长线列InGaAs焦平面组件的关键技术和主要性能结果,为更长线列焦平面组件的研制提供了坚实的基础。
The 256 × 1,512 × 1 element InGaAs linear focal plane module with spectral response of 0.9 ~ 1.7μm and the 256 × 1 element InGaAs linear focal plane module with spectral response extending to 2.4μm were developed. Focal Plane components include photosensitive chips, readout circuits, thermoelectric coolers, and package packages. The photosensitive chip is realized by a mesa structure on a InP / InGaAs / InP (p-i-n) double heterojunction epitaxial material and coupled with a readout circuit of 128 × 1 or 512 × 1 element CTIA structure. Focal Plane devices placed in dual in-line metal tube, the use of parallel seam welding methods for packaging. The key technologies and main performance results of InGaAs FPGAs with high uniformity are introduced, which provide a solid foundation for the development of LFP FPGAs.