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本文叙述了在微波和快上升时间脉冲/数字领域中,微电路应用的可控阻抗气密封装(CIP)的研制、特性和应用。主要意图是为高频微电路提供一种比通常使用的更为经济的封装样式。目前广泛使用的是采用分离的同轴接头的机械加工的外壳。这里描述的是带有窄带传输线母板接插的平面封装样式。介绍了包括电压驻波比在内的CIP的电特性。这里,电压驻波比的上限为1.15,频率上限为5千兆赫。本文也讨论了CIP的机械特性和物理特性,特别是对于保证可靠的封接能力和由此而决定的气密质量——漏泄速率。最后就CIP应用方法,包括微电路引入、装配和母板安装予以介绍。
This article describes the development, characteristics, and applications of controlled impedance hermetic packaging (CIP) for use in microcircuits in the microwave and fast rise time pulse / digital fields. The main idea is to provide a high-frequency microcircuit with a more economical package style than usually used. Currently widely used is the use of separate coaxial connector machined shell. Described here is a flat package with a narrowband transmission line motherboard connector. The electrical characteristics of CIP including voltage standing wave ratio are introduced. Here, the upper limit of voltage standing wave ratio is 1.15, the upper limit of frequency is 5 gigahertz. This article also discusses the mechanical properties and physical properties of CIP, in particular to ensure a reliable sealing capacity and the airtight mass-leakage rate that results from this. Finally, CIP application methods, including the introduction of microcircuits, assembly and motherboard installation to be introduced.